Should information on how that actual integrated circuits work be added?
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Description
what is the scope of this, should information about the different parts of each integrated circuit be added? or information on how the electrons travel about the package? IE: "from pin through TC bonded conductor to the bonding pand on the wafer" etc.
also, should things such as TC bonding or different oxide layers and their creation be added?
also, the analog side of all of this is not really even mentioned yet. should it be?
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