Time-Appliances-Project / Time-Appliances-Project/Time-Card
Time Card PCB queries from PCBway regarding vias in pad.
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Description
There are lot of vias in pads, should we fill them with resin?
If yes, should we fill all vias with resin or just fill vias in pads with resin?
I am trying it with the project available in PCB way and the version used is TimeCardV9_Gerbers.zip. Selected the option PCB+assembly.
Please let me know the correct way to do this.
Thanks
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First steps
- Read the whole issue, then the project's contributing guide.
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Research direction
Review the TimeCardV9_Gerbers.zip files and the PCBway PCB+assembly configuration described in the issue. Determine whether vias in pads require resin filling, which vias are affected, and document the manufacturing decision and rationale.
Written by the indexing model from the issue text.
Assessment
- Domain
- embedded-iot
- Issue type
- Documentation
- Difficulty
- 5/5
- Estimated time
- Over a week
- Activity status
- Stale
- Clarity
- Needs clarification
- Newbie friendliness
- 15/100