The-OpenROAD-Project / The-OpenROAD-Project/OpenROAD
Feature Request: 3D Viewer support for chiplet inter-die routing, bumps, and TSVs
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@jorge-ferreira-pii is already working on this.
Since Aug 1, 2026.
enhancement
web
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Description
Description
Currently, the OpenROAD 3DBlox 3D Viewer only displays chiplets as solid boxes (along with DRC markers). There is no support for rendering inter-chip wiring, bumps, or TSVs (Through Silicon Vias). While bumps are visible in the 2D viewer as COVER_BUMP instances, TSVs lack dedicated support in either viewer.
This feature request is to add 3D rendering support for these interconnect elements to improve the 3D visualization capabilities.
Suggested Solution
No response
Additional Context
This feature request originates from Discussion #10992
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