OLIMEX / OLIMEX/ESP32-P4-DevKit
ESP32-P4 thermal pad vias vs manufacturer footprint
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- Dominant language
- C
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- 59
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Description
Hello ,
Could you please explain the purpose of adding vias under the ESP32-P4 chip? Is this primarily for cooling?
I noticed that the official manufacturer footprint includes the pads, but it does not have any vias in them. I'm wondering if I should add vias myself or stick to the reference design. Thanks in advance!
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Research direction
No files or tests are identified. Start by comparing the ESP32-P4 manufacturer footprint with the board's reference design, then document whether the thermal-pad vias are required and what their intended purpose is.
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Assessment
- Domain
- embedded-iot
- Issue type
- Documentation
- Difficulty
- 5/5
- Estimated time
- Over a week
- Activity status
- Stale
- Clarity
- Needs clarification
- Newbie friendliness
- 20/100