[Request] Device Tree, Kernel Source, and Vendor Blobs for POCO F8 Ultra / Redmi K90 Pro Max (myron)

Device(s): POCO F8 Ultra / Redmi K90 Pro Max
Codename: myron
Chipset: Qualcomm Snapdragon 8 Elite Gen 5 (SM8850-AC)
Models: 25102RKBEC, 25102RK69C, 25102PCBEG

Hello Xiaomi Team,
We, the community, are writing to formally request the release of the device tree, kernel source code, and associated vendor blobs for the POCO F8 Ultra / Redmi K90 Pro Max (codename: myron).

This device ships with and runs the Linux kernel. Under the terms of the GNU General Public License version 2 (GPLv2), any distributed binary that incorporates GPLv2-licensed code obligates the distributor to make the complete corresponding source code available to recipients. As this obligation applies to production units of this device that are already shipping to consumers, the source release is not a courtesy but a license requirement.

Specifically, we are requesting:

1. Kernel source code, including all Xiaomi/Qualcomm modifications and patches applied for this device
2. Device tree sources for myron
3. Vendor blobs / proprietary binaries necessary to build a functioning AOSP-based system for this device (to the extent their distribution is required or customarily provided alongside the kernel release)

Releasing these sources in a timely manner would:
• Bring this device into compliance with GPLv2 obligations
• Allow the custom ROM and kernel development community to build and maintain AOSP-based software for this device
• Continue Xiaomi's established practice of supporting open-source development on its devices

We appreciate Xiaomi's past commitment to the developer community and look forward to the timely release of these sources to maintain GPL compliance.

Thank you for your time and cooperation.

The issue names no repository files, tests, or entry points. Start by reviewing the request for the myron device and identifying whether this repository contains the kernel source; done would mean the requested kernel source, device tree, and applicable vendor materials are released.